In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far, I’ve attended lunch at Amkor Technology and more recently, Happy Hour at Deca Technologies.
Each event started off with a technology presentation by the host company, followed by networking. In each case, I realized how fortunate that we chose to headquarter 3D InCites in this growing epicenter for the microelectronics community.
What inspired me to write about the power of community was the recent event hosted by Deca Technologies, where IMAPS Arizona chapter gathered for cocktails, conversation, charcuterie, and Adaptive Patterning updates.
Cliff Sandstrom, SVP of Technology Development at Deca, gave a short presentation titled, Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on a Molded Embedded Bridge Die Interposer, and fielded questions from the audience about this new implementation of the company’s Adaptive Patterning and M-Series technologies. Sandstrom presented a lot of details and data from test vehicles and showed demonstrations of how it all works.
Some of the high-level takeaways:
- Adaptive Patterning is Deca’s propriety solution to solve the die shift problem initially developed for its M-Series, the highest volume fan-out technology in the industry.
- As the industry moves towards the adoption of embedded bridge die interposers, Deca’s technology team is developing the Adaptive Patterning roadmap to allow scaling to finer features and support high-density and ultra-high-density applications.
- All of this is supported by AP Live architecture, a complete system involving design constraints embedded in the software, and design tools and equipment that work together.
- The next implementation, Adaptive Pad Stacks, targets die-to-die chiplet applications and promises to provide a breakthrough solution that removes the scaling roadblocks. It allows for using a high-speed chip shooter, versus a high-accuracy die bonder because Adaptive Patterning takes care of the alignment after die placement, while also accounting for die shift in the mold compound. Rather than placing 2500 chips per hour, you can place 25000 chips per hour, for a 10X improvement, as well as CapEx savings.
The Happy Hour
While the presentation was great and important, let’s be honest, it’s the promise of the Happy Hour and networking afterward that brings in the crowd, and helps foster the community.
I enjoyed meeting Gaurang Gunde, a Deca employee who told me he first reached out to the company after hearing Deca’s Robin Davis interviewed on the 3D InCites Podcast about chiplet design. I always emphasize to our 3D InCites community members that the way to get the most out of their membership is through active participation. And here was proof of the power of community in action.
Chatting with SemiSister, Lori McDonald, head of HR at Deca, I learned of Deca’s collaboration with Arizona State University’s Fulton School of Engineering to help develop micro-credentials in engineering and technology as part of FSE’s new undergraduate degree with concentrations in Digital Chip Design and Semiconductor Microelectronics.
Deca’s participation 3D InCites over the years is evident in its trophy case, where three 3D InCites Awards, two mural replicas, and the membership sign were proudly on display, along with awards from this year’s IMAPS Symposium 2023. The company was honored with the Corporate Recognition Award for its technical contributions to the industry, as well as participation and support of IMAPS events. Additionally, Robin Davis, Deca’s Director of Business Development was awarded the Emerging Leader Award for her contributions to the society.
It struck me how much value Deca gets from its involvement in all these organizations.
At 3D InCites, we also understand the value of collaboration with partners like IMAPS. While they provide in-person events, we focus on giving our members a platform to share their knowledge. Through this collaboration, our collective members are ensured ongoing visibility throughout the microelectronics community. If you’re a member of IMAPS, but not part of the 3D InCites community, I invite you to learn more here.
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