The ACEPACK DMT-32 family of silicon carbide (SiC) power modules from STMicroelectronics is designed to enhance flexibility for system designers by presenting a choice of four-pack, six-pack and totem-pole configurations. The power modules come in a 32-pin, dual-inline, moulded, through-hole package for automotive applications. Targeted at systems such as onboard chargers (OBC), DC/DC converters, fluid pumps and air conditioning, the SiC power modules deliver advantages including high power density, a compact design and simplified assembly.
The modules contain 1200 V SiC power switches that leverage ST’s second- and third-generation SiC MOSFET technology, to provide low RDS(on) values. The devices also provide efficient switching performance with minimal dependence on temperature for high efficiency at converter system level.
Leveraging ST’s ACEPACK technology, the modules are designed to reduce overall system- and design-development costs. The package technology features a high-performance aluminium nitride (AlN) insulated substrate for enhanced thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.
The first product in the ACEPACK DMT-32 family is the M1F45M12W2-1LA. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production starting from Q1’24.
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